MediaTek Pushes Flagship Smartphone Performance Further with the Dimensity 9200+

MediaTek, a leading semiconductor company, is once again making waves in the smartphone industry with its latest offering, the Dimensity 9200+ chipset. This new addition to the Dimensity portfolio is specifically designed for flagship 5G smartphones, aiming to elevate performance to new heights while maintaining power efficiency.

The Dimensity 9200+ takes the success of its predecessor, the Dimensity 9200 chipset, and builds upon it with notable enhancements. One of the key upgrades is the support for higher clock speeds, which translates to improved overall performance. The chipset features an impressive combination of cores, including one ultra-core Arm Cortex-X3 clocked at up to 3.35GHz, three Arm Cortex-A715 super-cores running at up to 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz. Additionally, MediaTek has boosted the chipset’s Arm Immortalis-G715 GPU by 17%, providing an extra boost for gaming and compute-intensive applications.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, highlighted the focus on gaming features and performance, stating, “We continue to raise the bar for flagship performance and power efficiency with the Dimensity 9200+, ensuring device makers have access to the most powerful mobile gaming features available today.”

The Dimensity 9200+ also comes equipped with a 4CC-CA 5G Release-16 modem that seamlessly switches between long-reach sub-6GHz and super-fast mmWave connections. In addition, the chipset supports Wi-Fi 7 2×2 + 2×2 with a data rate of up to 6.5Gbps and Bluetooth 5.3. MediaTek’s Bluetooth and Wi-Fi coexistence technology enables simultaneous connections with low latency and no interference, allowing for a smooth and uninterrupted user experience.

Key features of the MediaTek Dimensity 9200+ include the HyperEngine 6.0, which enhances the gaming experience with adaptive performance technology to sustain high framerates and minimize latency. The chipset also utilizes the second-generation TSMC 4nm-class process, making it ideal for ultra-slim designs across various form factors. The sixth-generation AI Processing Unit (APU 690) efficiently powers AI tasks, enabling noise reduction, super-resolution, real-time focus, and Bokeh adjustments for truly cinematic video experiences. Furthermore, the MediaTek Dimensity 9200+ incorporates the MediaTek Imagiq 890, a powerful flagship image signal processor that captures stunning images and videos even in low-light scenarios. The MediaTek MiraVision 890 display technology ensures a fluid user experience with adaptive refresh rate technology and motion blur reduction. Lastly, the chipset incorporates MediaTek 5G UltraSave 3.0 power efficiency technologies, optimizing battery life for all 5G connection conditions.

Smartphones powered by the MediaTek Dimensity 9200+ are expected to hit the market in May 2023. As MediaTek continues to push the boundaries of smartphone performance, users can look forward to flagship devices that offer unparalleled power, efficiency, and gaming capabilities. To learn more about MediaTek’s mobile platform and its offerings, visit their website at

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